The detection of SMT product technology is also constantly updated, from people with a variety of testing equipment to emerge in an endless stream detection magnifying glass or microscope artificial eye, but with zero SMT device accuracy is more and more high mount smaller -0603; 0402 or less, the inspection ability is far from enough, and Aoi automatic optical inspection equipment is upgrading, more remarkable efficiency! So, with the development of PCBA industry, the function is stronger, the smaller the size, Aoi will be more and more show its important position! With the help of AOI, and then the human eye inspection, 0402 of the following components can not be detected, you can use AOI to check, the false alarm re inspection. Could AOI+ICT yes, just a small circuit board element, no place under ICT. Of course, do not rely on inspection, to statistical failure, to find a way to improve the process, less defect is the fundamental way! With a powerful SPC function, the real measurement data and product line, steel mesh and printing parameters of the association, automatic judgment, automatic production statements! Return online type 3D SPI into the solder paste inspection equipment (SPI)

According to statistics, 1) SPI into the original PCB product failure rate to reduce more than 85%; repairscrap greatly reduced the cost of more than 90%, significantly improve the quality of manufactured products. The combined use of SPI and AOI, based on the SMT production line real-time feedback and optimization, the production quality is more stable and unstable stages shorten new product introduction to experience, the corresponding cost more to save.

2) can significantly reduce the AOI of the solder on the false positive rate, thereby improving the straight through rate, effectively saving human error correction, time costs. According to statistics, the current product PCB in 74% of the unqualified and the solder has a direct relationship, 13% have an indirect relationship. SPI through 3D detection means to effectively make up for the shortcomings of traditional detection methods

3) part of the PCB components such as BGA, CSP, PLCC chips, due to their characteristics of the light shielding patch after reflow AOI can not be detected. And SPI through the process control, the maximum reduction of the furnace after the bad situation of these devices.

4) with the increasing precision of electronic products and lead-free solder, the patch components are becoming more and more micro, so the solder paste printing quality is becoming more and more important. SPI can effectively ensure the good quality of printing products, greatly reduce the non-performing rate possible.

5) as a quality process control method, can the quality of timely detection of problems in reflow soldering, it is almost impossible to rework and scrap costs, effective cost savings.