SMT(Surface Mounting Technology)Mount quality depends largely on the solder paste printing quality, the quality of welding solder paste printing quality will directly affect the components. For example, it will lead to missing components welding, solder bridging will lead to short-circuit welding, solder paste collapse will lead to fault components weld etc.. The solder paste thickness is an important indicator to determine the quality and reliability of solder joints. In the actual production process, through the printing, the solder paste is surface is not flat, but there are still many uncontrollable factors in the process of printing. Therefore, 3D solder paste test technology and used to produce solder paste quality test. The measurement result has good representativeness and stability, this is because the technology in the measurement of time is the average multiple sets of data units within the scanning area value to represent the thickness of solder paste. Paste 3D laser scanning measurement system based on WaltronTech is the principle of laser vision measurement, scanning of the paste obtained through the measurement of 3D data, the data processing can get the accurate thickness information, and width and other three-dimensional topography. The application of this technology can save the cost of semiconductor production and improve the reliability of the chip mounting.