It is well known that solder paste printing process will produce many defects is an indisputable fact. Some publications and companies even pointed out that the number of such defects accounted for 74% of the total number of defects.     Another indisputable fact is the volume of solder paste is to determine the quality and reliability of solder joints is an important indicator.     100% solder paste inspection (SPI) will help reduce solder joint defects that occur during the printing process and reduce scrap losses by minimizing rework (such as cleaning circuit board) costs. Another benefit is the ability to solder The reliability of the points will be ensured.

The development of all things must be driven by some underlying factor.

In the solder paste printing process control process, how to find the impact of process trends, it means that we must find this potential factors.

The quality of the product has not entirely rely solely on the specifications of manufacturing equipment and precision to ensure. Especially for small components and high-density packaging components. Product reliability is the most important factor in ensuring product quality.

Digital Grating Controller

● SGO-500

● Rack

● INLINE-SPI complete machine

Digital Grating Controller

● SGO-500D

● Rack

● INLINE-SPI complete machine

Traditional SMT high - end product manufacturing line

Products in order to ensure efficient and stable production printing presses, must be placed behind a line solder paste inspection equipment to ensure cost and large presses budget $ 60,000, SPI-line solder paste inspection equipment $ 60,000, a total of 120,000 US dollars / article

Equipped with PDG grating controller production line

● The new production line is not only cost-effective than traditional SMT high-end product manufacturing line, but also save space, lower maintenance costs.